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Main purpose of the equipment:
It is used for outer layer plug-in processes such as solder mask exposure and solder mask development
Equipment specification:
Length: 2660mm
Width: 1565mm
Height: 940mm
Working height: 950mm ± 25 (optional)
Applicable plate specification:
Maximum panel size: 710 x 710mm
Minimum panel size: 300 x 300mm
Plate thickness: 0.5-3.2mm
Production rate: 6Pcs/min
Power supply: 1Ph 220V 50Hz 1.5KW
Air source: 0.6Mpa

Equipment features:
The equipment can complete automatic retraction and retraction board
The equipment is equipped with H-shaped plate rack plug-in type, which can avoid contact with plates
The rack is treated with high hardness corrosion resistant contact baking paint
The equipment can complete automatic exchange of empty frame plate frame without personnel operation
The free roller form is adopted for the top racket to effectively reduce the friction of the plate
The equipment has low power and gas consumption and power saving mode