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Main purpose of the equipment:
It is mainly used for the temporary storage process of flap, such as: solder proof development, green oil development, DES, etc
Equipment specification:
Length: 1660mm
Width: 1000mm
Height: 1080mm
Working height: 900mm ± 25mm (optional)
Applicable plate specification:
Maximum plate size: 710mm * 710mm
Minimum plate size: 250mm * 250mm
Plate thickness: 0.5mm-3.2mm
Production rate: 8Pcs/min
Power supply: 1Ph 220V 50HZ 0.4Kw
Air source: None

Equipment features:
With flap cooling function
It has the function of board placement and online
The retraction and retraction of the board can be selected in 1, 2 and 4 grids, and can be applied to large size PCB boards
The machine adopts powder baking paint, which is suitable for working space with acid and alkali
The equipment can be used with automatic line process or single machine
The appearance of the rack is treated with multi-layer anti-corrosion anti-collision baking varnish
The equipment has low power consumption, low oxygen consumption and power saving mode